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Dual Chamber Curing Oven

Dual Chamber Curing Oven

The double-chamber oven falls into precision baking and curing equipment with two independent working chambers;

Dual-chamber independent control, high-efficiency hot air circulation, precise temperature control, feeding and blanking of master-child charging skip (limited to the left and right cavity), optional nitrogen filling function and filter (100-level dust-free), intelligent control, data collection and upload, etc. can be customized as needed;

Dual Chamber Manual Curing Oven for R&D and Small Batch Production

Dual chamber manual oven for PCB, electronics & semiconductor R&D. Independent controls, N2 option, HEPA filtration, data logging. Perfect for prototyping & low volume production.

Dual Chamber Curing Oven provides unmatched flexibility for research, development, and small batch production environments. Featuring two completely independent work chambers with multiple material shelves, this precision baking and curing system allows simultaneous processing of different products under varying temperature profiles. Ideal for PCB manufacturing, electronic component production, panel manufacturing, and semiconductor device development, it delivers laboratory-grade precision with production-level reliability.


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Product Advantages

1. Dual Independence, Maximum Process Flexibility
Functioning as two separate ovens in one, the dual independent chambers allow for simultaneous operation with different temperature profiles and timing cycles. This doubles processing throughput and provides unparalleled flexibility for R&D and small-batch production, enabling multiple processes or materials to be handled at once.

2. Compact Design, Optimizing Cost and Footprint
The innovative single-unit, dual-chamber design requires up to 40% less capital investment than purchasing two separate ovens. Its compact footprint maximizes thermal processing capability within limited laboratory or production floor space, delivering a superior return on investment.

3. Precision Control for Demanding Applications
Each chamber delivers ±1°C temperature uniformity with independent programmable controls. Optional Nitrogen purge and Class 100 HEPA filtration create a critical inert and clean environment, making it ideal for sensitive processes in semiconductor, SIP packaging, and advanced electronics that are vulnerable to oxidation and contamination.

4. Smart & Scalable, Bridging R&D and Production
Equipped with intelligent recipe management and data logging/upload capabilities, the system ensures full process traceability and repeatability. It is the perfect solution to bridge the gap between R&D prototyping and full-scale production, with a design that allows for future integration into higher-level automated systems.



Industry Applications

Widely used in electronics manufacturing r&d 、semiconductor device development 、pcb prototyping and small batch production 、display panel research laboratories 、academic and research institutions 、quality control and failure analysis 、material science research .




Dimension (L*W*H)2600*1680*2200mm
MAXIMUM OPERATING TEMP250℃
AIR FLOWForced Convection, Side to Side
Heating and cooling rate200°C, heating time 20 minutes
CONTROL ACCURACY±0.1 Advantages
OVEN UNIFORMITY±3℃
WORKS SPACE DIMENSIONS (WxDxH)(800*900*1500)mm*2
Power
AC380V/50HZ  42KW


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Automation equipment enterprise

19 years of focus on research and development as well as production