Vacuum Pressure Defoaming Oven

Industrial Vacuum Pressure Defoaming Oven | Bubble Elimination System

SHIHAO'S Vacuum Pressure Defoaming Oven is a state-of-the-art industrial system designed to eliminate bubbles and voids in sensitive manufacturing processes across high-tech industries. By utilizing synchronized control of temperature and pressure, this equipment effectively removes air entrapped during the lamination and encapsulation of materials, significantly enhancing product reliability and yield

This intelligent defoaming solution is engineered to meet the stringent requirements of display manufacturing, semiconductor packaging, automotive electronics, and aerospace composites, providing a critical step towards achieving zero-defect production.

Applications & Solutions

Display Manufacturing

LCD Panel Production: Efficiently eliminates bubbles in polarizer lamination, ensuring flawless optical performance.

Touch Screen Fabrication: Removes microbubbles between glass and conductive film layers, crucial for high-quality touch interfaces.

Semiconductor & Electronics

Semiconductor Packaging: Eliminates voids in chip encapsulation (e.g., underfill) and die-attach materials, preventing reliability failures.

Advanced Packaging: Supports high-yield production in processes like 3D IC and Fan-Out Wafer Level Packaging (FOWLP) by removing detrimental bubbles.

Automotive Electronics

IGBT Power Modules: Provides comprehensive bubble removal in silicone gels and epoxy encapsulants, directly addressing the industry's challenge of moisture-induced delamination and enhancing thermal performance for modules used in EVs and industrial drives.

Automotive Displays: Ensures bubble-free bonding of instrument clusters and infotainment screens.

Aerospace & Defense

High-Performance Composites: Eliminates voids in composite materials during curing or bonding processes, which is critical for structural integrity and performance in extreme environments.