Clean Room Ovens

In-Line Precision Clean Room Oven for Critical Electronics Manufacturing

SHIHAO'S in-line precision clean room oven delivers exceptional thermal processing for the most demanding electronics manufacturing applications. Specifically engineered for camera modules, display panels, semiconductor devices, and System-in-Package (SIP) applications, this oven provides a Class 100 clean environment with multi-zone temperature control and rapid cooling capabilities, ensuring perfect results for your most sensitive components.

Product Advantages

• Yield Improvement: Class 100 clean environment prevents contamination during critical curing processes

• Process Consistency: Multi-zone temperature control ensures uniform thermal profile across all products

• Throughput Optimization: Rapid cooling capability significantly reduces cycle times versus conventional ovens

• Quality Assurance: Complete data logging and MES integration provides full process traceability

• Custom Fit: Tailored solutions ensure optimal performance for your specific application

• Precision Control: ±0.5°C temperature uniformity across all zones with precise ramp rate control

• Rapid Thermal Cycling: Advanced water cooling system enables fast transition between process steps

• Cleanroom Compatibility: Maintains Class 100 conditions throughout operation with HEPA filtration

• Smart Operation: Recipe management, remote monitoring, and predictive maintenance capabilities

• Seamless Integration: Standard interfaces for easy integration into automated production lines

Technical Specifications

• Cleanroom Class: Maintains Class 100 (ISO 5) conditions

• Temperature Range: Ambient to 250°C (customizable)

• Temperature Uniformity: ±0.5°C across all zones

• Heating Rate: 3-5°C/minute (typical)

• Cooling Rate: 2-4°C/minute with water cooling

• Control System: PLC with color touchscreen HMI

• Data Logging: Comprehensive recipe and process data storage

• Communication: Ethernet/IP, RS-485, SECS/GEM optional

Industry Applications

Widely used in camera module manufacturing、display panel production、semiconductor assembly、system-in-package (sip) processing、advanced pcb assembly、medical device manufacturing、automotive electronics.