Automated Pressure Curing Oven
Multiple pressure ovens are connected in series on a single line；
Each oven can be set with different process parameters (such as different temperatures pressures or holdup times) ;
It has achieved full-process automation, reduced personnel contact；
Ensured the stability of production rhythm and product consistency ;
Product Overview
Multiple pressure ovens are connected in series along a single production line, with each oven capable of being configured with distinct process parameters (such as varying temperatures, pressures, or pressure holding times). This setup achieves full-process automation, minimizes personnel contact, ensures stable production cadence, and guarantees product consistency.
Applications
Widely used in LCD panel manufacturing (removing bubbles during polarizer lamination), touchscreen production (eliminating bubbles between glass and conductive film), semiconductor packaging (removing bubbles in chip bonding), automotive electronics (de-bubbling IGBT power modules), and aerospace (de-bubbling high-performance composite materials).
| Dimension (L*W*H） | 7200*3000*2500mm |
| Inside diameter (㎜) | Φ1000mm |
| Inside depth (㎜) | 1200mm |
| Pressure (bar) | 0.1-8Mpa |
| Heating Rate | 100°C, 15-minute heating time |
| Temperature Accuracy | ±1℃ |
| Temperature Uniformity | △T≤3℃ |
| Temperature Setting range | RT ~250 ℃ |
| Power | AC380V/50HZ，20KW |
