Vertical Curing Ovens
Vertical curing oven falls into industrial-grade heat treatment equipment specially designed for efficient and uniform thermal curing (baking) processes;
The materials run vertically within the furnace cavity to make full use of the spatial height and effectively reduce the floor area of the equipment, thus it is particularly suitable for modern production lines with limited space;
The vertical multilayered structure, front and rear inspection conveyors, high-efficiency hot air circulation;
Vertical Curing Oven Space-Saving Thermal System for Electronics
Vertical curing oven for PCB, semiconductor & PV manufacturing. Multi-layer design, N2 inert atmosphere, precise temperature control, 60% less footprint.
This industrial-grade thermal curing system features a vertical material flow that maximizes utility of vertical space while minimizing the equipment's footprint. Specifically engineered for PCB manufacturing, electronic assembly, semiconductor packaging, and photovoltaic cell production, it delivers uniform, consistent results for the most demanding thermal curing applications.
Product Advantages
Space Optimization: Vertical design reduces floor space requirements by up to 60% compared to horizontal ovens；
Process Efficiency: Integrated loading/unloading conveyors enable seamless integration into automated production lines；
Operational Excellence: Nitrogen inert atmosphere capability minimizes oxidation and improves product quality；
Precision Thermal Control: ±1°C temperature uniformity with programmable multi-zone heating profiles；
Advanced Atmosphere Control: Nitrogen purging system creates optimal inert environment for sensitive processes；
Efficient Material Handling: Multi-layer vertical design with synchronized loading/unloading systems；
Widely used in PCB solder mask and legend curing , Electronic component encapsulation , Semiconductor underfill and epoxy curing , Photovoltaic cell backsheet lamination , Precision coating and adhesive curing , Conformal coating and potting compounds .
| Dimension (L*W*H） | 2500*1300*2100mm |
| Storage quantity | 20 shelf (two trays per shelf) |
| Temperature Accuracy | ±1℃ |
| Temperature Uniformity | △T≤3℃ |
| Temperature Setting range | RT ~250 ℃ |
| Temperature Control mode | PID closed-loop control +SSR drive |
| Warming up time | 15min Approx.15min |
| Cycle Time | ≥10S |
| Power | AC380V/50HZ，16KW |
| Cleanroom class | Optional |
