Pressure Curing Oven
Vacuum environment with nitrogen purge eliminates oxidation, ensuring highest product quality and reliability ;
Combined vacuum and pressure capabilities accelerate curing cycles and improve material properties ;
Comprehensive data logging and recipe management ensure process repeatability and compliance ;
Product Overview
This is semiconductor oven with nitrogen filled has strong universality, high stability and high performance. It adopts high capacity horizontal air recycling system, adopts special chamber structure and sealing technology, with excellent air tightness and temperature uniformity to meet the high performance requirements of semiconductor products. This oven is suitable for curing semiconductor wafers, IC packages (copper substrate, silver gel, silica gel, epoxy resin), glass substrate and other products.
Key Features
High capacity horizontal air recirculation hot air system
The chamber is fully sealed design, adopts stainless steel plate, with good air tightness, saving nitrogen
The upper and lower box can run independently with different process parameters to meet the production of different products
The heating rate is controllable, and the cooling system assists the cooling, which can effectively improve the production efficiency
High precision temperature controller, the control accuracy can reach to 0.5℃
Test by Class 1000 clean room, it can meet the semiconductor dust-free workshop and product requirements
Low oxygen content control, real-time monitoring, the oxygen content can be controlled within 100PPM
Applications
The semiconductor oven with nitrogen filled has strong universality, high stability and highperformance. it adopts high capacity horizontal air recycling system, adopts special chamberstructure and sealing technology, with excellent air tightness and temperature uniformity tomeet the high performance requirements of semiconductor products, This oven is suitablefor curing semiconductor wafers, lC packages (copper substrate, silver gel, silica gel, epoxy resin),glass substrate and other products.
| Dimension (L*W*H） | 1550*1820*1520mm |
| Box dimension (L*W*H） | 400*600*400mm |
| Temperature operating range | Room temperature+10℃~250℃ |
| Temperature control mode | PID closed-loop control+SSR drive |
| Pressure range | 1.0Mpa-100pa |
| Temperature accuracy | ±0.1℃ |
| Temperature uniformity | ±2%℃(no- load) |
| Temperature accuracy | ±0.5℃ |
| Heating rate | ≥5℃/min |
| Cooling rate | 2-5℃/min |
| Hot air system | Hot air circulation system with adjustable wind speed and volume |
| Power | AC380V/50HZ,35KW |
