Automatic Expansion Film Laminator | TFT Glass & Wafer Mounting System
Fully automatic system for mounting expansion blue film on TFT glass (50-90um) and semiconductor wafers. Features iron ring fixing, CST unloading, mapping inspection, and Industry 4.0 data capability. Boost your precision mounting process.
Maximum Flexibility: Handles multiple material types including expansion blue film, UV film, iron rings, and CST cassettes with quick changeover between product variants
Reduced Operational Costs: Replaces multiple manual process steps with a single automated system, significantly lowering labor requirements and material waste
Future-Proof Investment: Industry 4.0 ready with full data tracking and recipe management ensures compatibility with evolving smart factory requirements
High Utilization Rate: Capable of running multiple product families with minimal changeover downtime maximizes equipment ROI
Automatic material type identification and recipe selection
Precision positioning and alignment correction
Expansion film mounting and laminating
Automated inspection and mapping
CST cassette handling and unloading
Industry 4.0 data upload and recipe management
Material Compatibility
Substrates: TFT glass (50-90μm), semiconductor wafers
Films: Expansion blue film, UV tape
Carriers: Iron rings, CST cassettes
Product Sizes: Multiple configurations supported
| Dimension(mm) | 6500*3000*2350mm |
| Cycle Time | 100s/pcs |
| Placement Accuracy | ±0.01 mm |
| Adaptive Products | 100*100-400*350 mm; Iron Hoops, 12–20 inches |
| Failure Rate | ≤0.5% |
| Pass Rate | ≥99.9% |
| Switching processing types time | ≤2h |
| Barometric Pressure | 0.5-0.7Mpa |
| Weight | 8500KG |
| Rated Power | 25KW |
19 years of focus on research and development as well as production