Automatic Label Applicators

Precision Placement Equipment | Automation Expert for PCB/FPC/Module Component Placement

SHIHAO Fully Automatic Placement Equipment, specifically designed for PCB/FPC/display/camera modules. Precisely places QR codes, thermal silicone gel, graphite sheets, dust filters, and more, with a maximum throughput of 5000UPH. Features top and bottom CCD vision alignment and self-locking quick-change nozzles. Provides efficient and stable solutions for procurement and engineering teams.

Fully Automated Placement Equipment for Precision Electronic Component Accessories: Redefining Efficiency and Precision

In the production of PCBs, FPCs, displays, and camera modules, the precision and efficiency of auxiliary material placement directly determine product performance, reliability, and manufacturing costs. Traditional manual operations suffer from slow speeds, inconsistent accuracy, and high costs. SHIHAO's fully automated placement equipment integrates cutting-edge vision alignment and motion control technologies to deliver unmanned, high-precision, high-throughput automated production, significantly boosting yield rates and competitiveness.

• Dual CCD Vision Alignment: The upper camera precisely locates products while the lower camera accurately positions materials, achieving ±0.05mm placement accuracy.

• Modular Placement Heads: Selectable head quantities flexibly adapt to production capacity and cost requirements, reaching up to 5000UPH.

• Smart Self-Locking Nozzles: Innovative self-locking mechanism enables second-level rapid nozzle changes, accommodates various irregular components, and significantly reduces changeover time.

• Flexible Feeding Platform: Supports both single- and double-sided feeding designs, compatible with multiple feeding stations, enables non-stop production for maximum efficiency.

• Integrated Control System: Intuitive UI interface with recipe-based management allows one-click switching between products, enabling intelligent production.

Core Adhesive Materials

• Functional Labels: QR codes, barcodes, serial number labels.

• Thermal Conductive Materials: Thermal silicone gel, heat dissipation graphite sheets, phase change materials.

• Bonding Materials: Double-sided tape, high-temperature adhesive tape, PET Mylar sheets.

• Protective Materials: Dust filters, protective films, insulating sheets.

Widely used for bonding thermal pads under shielding covers of motherboard components; bonding reinforcement steel sheets, conductive adhesives, and protective films on flexible printed circuits; bonding light-enhancing films, diffusion sheets, and graphite heat sinks in backlight modules; bonding lens dust filters, sensor shielding covers, and VCM springs.