In the advanced packaging of AI and HPC chips, even a micrometer-sized bubble can trigger a yield disaster. The debubbling process has evolved from a supplementary step to a critical function ensuring reliability. This article will delve into how modern debubbling equipment addresses this core challenge.

Root Cause: Why do bubbles form during epoxy resin curing? How do these bubbles expand during high-temperature reflow soldering, causing gold wire breakage and package delamination?

Technical Evolution: From traditional hot-air convection to modern high-vacuum + stepwise temperature control. Explains why mere “high temperature” is no longer sufficient, while the combination of “high vacuum levels” (e.g.,<5 Pa) and “precise ramping profiles” effectively extracts solvent residues and moisture.

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Data Support:“Our experimental data shows that equipment utilizing a five-stage vacuum extraction process can reduce the void rate in IC packaging from the traditional ~5% to below 0.1%.”

Display a simplified comparison chart: The horizontal axis represents process type (traditional oven vs. modern degassing machine), while the vertical axis shows void rate (%). This visually highlights the difference.

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Is your product FOWLP or 3D stacking? Different structures have entirely different requirements for vacuum levels and temperature curves.